Manufacture of resin-sealed semiconductor device

Abstract

PURPOSE: To form a hollow part by a low-cost resin sealing operation only without putting a lid by a method wherein a hermetically sealed resin lid is molded by using a resin injected into a metal mold by leaving a space including a chip by the action of a centrifugal force generated when the metal mold is turned. CONSTITUTION: A substrate 1 on which a chip 2 has been mounted is supported inside a cavity 14 formed by split metal molds 8. The substrate 1 in which an uneven part 1a has been formed on the surface at its whole circumference is used. The substrate 1 is supported; after that, a resin 4a before it is hardened is injected into the cavity 14 of the split metal molds 8. Before the resin is hardened, the split metal molds 8 are turned with an axial line X as the center. At this turning operation, the resin inside the cavity 14 flows along the inner surface of the metal molds by the action of a centrifugal force. A resin lid whose shape leaves a space including the chip 2 is molded; its whole circumference part is bonded and united to the uneven part 1a at the substrate 1. After the resin has been hardened, the split metal molds are removed. Thereby, a hollow part 7 can be formed by a low-cost resin sealing operation without putting a lid on the semiconductor chip 2. COPYRIGHT: (C)1991,JPO&Japio

Claims

Description

Topics

Download Full PDF Version (Non-Commercial Use)

Patent Citations (0)

    Publication numberPublication dateAssigneeTitle

NO-Patent Citations (0)

    Title

Cited By (6)

    Publication numberPublication dateAssigneeTitle
    US-6001671-ADecember 14, 1999Tessera, Inc.Methods for manufacturing a semiconductor package having a sacrificial layer
    US-6093584-AJuly 25, 2000Tessera, Inc.Method for encapsulating a semiconductor package having apertures through a sacrificial layer and contact pads
    US-6294830-B1September 25, 2001Tessera, Inc.Microelectronic assembly with conductive terminals having an exposed surface through a dielectric layer
    US-6821821-B2November 23, 2004Tessera, Inc.Methods for manufacturing resistors using a sacrificial layer
    US-6856235-B2February 15, 2005Tessera, Inc.Methods for manufacturing resistors using a sacrificial layer
    US-7165316-B2January 23, 2007Tessera, Inc.Methods for manufacturing resistors using a sacrificial layer